Schott and Moritex’s innovative inspection system for silicon wafers not only checks the outer surface of the substrates, but also the internal quality of wafers.
Schott and Moritex presented an innovative inspection system for silicon wafers in MEMS manufacturing at Vision 2011. By using both visible and infrared light, the “IR-MEMS Inspector” not only checks the outer surface of the substrates, but also the internal quality of the wafer. Scanner and detection software provide a flexible and economical solution for MEMS and semiconductor fabrication.
Tiny machines, so-called micro-electromechanical systems (MEMS) ease everyday life. In cars, these little helpers measure and report the acceleration and tire pressure and know where up and down is in mobile phones. MEMS are key devices for many innovative applications and, because of their low material and energy consumption, they are also highly cost-efficient. However, their assembly is quite a challenge due to the fine structures of the components.
Thereby the small electromechanical elements are applied to a substrate – mostly made of silicon – and then covered with a protective lid. If dust or micro-particles get into the interior during bonding however, the unit may get damaged. Quality assurance with the help of microscopes is time consuming and inaccurate, a fully automated inspection however is often prohibitive for many smaller companies.
Here, the “IR-MEMS Inspector” from Schott and Moritex provides a new perspective. ”Our IR inspection system makes use of the fact that silicon transmits infrared light and can automatically check devices for defects“, explains Junya Inoue, product manager and application engineer at Moritex in Tokyo. “The silicon wafer is entirely penetrated and inspected for damage on the surface, bottom and internally in one single step.”
The “IR-MEMS Inspector” unites sub-micrometer accuracy and the advantages of automated inspection in a 730x625x705mm sized, 85 kilos light and competitive priced device. It is equipped with several zoom levels and abundant, user-friendly software. In addition, multiple illumination and measurement functions as well as automated loading of up to 8-inch wafers are optionally offered.
”This is a new type of inspection system which combines the advantages of a fully automated multi-spectral inspection system with the desire for flexibility and economic efficiency,” says Matthias Endig, sales manager Machine Vision Europe at Schott in Mainz. The “IR-MEMS Inspector” is especially suitable for academic associations, bonding and MEMS device manufacturers.