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Southwall Technologies and Dow Corning join forces

Southwall Technologies Inc. and Dow Corning Corporation have announced the availability of energy-efficient Heat Mirror S film and 982FS two-part structural silicone sealant for commercial building pr…

Southwall Technologies Inc. and Dow Corning Corporation have announced the availability of energy-efficient Heat Mirror S film and 982FS two-part structural silicone sealant for commercial building projects in North America. Thanks to more than 30 years of working together, the two companies are now combining the best of their suspended film and silicone sealant technologies to provide the lightest weight and most energy efficient multi-cavity insulating glass available for large glass-intensive projects. This combined solution will enable architects and window manufacturers to increase energy savings by up to 30%, block over 99% of UV radiation and reduce sound transmission by up to 20% over dual-pane glass. Based upon an advanced thin film coating, which is fully compatible with Dow Corning 982FS two-part structural silicone sealant and Dow Corning 982-H Curing Agent, Heat Mirror S film delivers superior performance as compared to traditional dual-pane glass. Dow Corning 982FS and Dow Corning 982-H Curing Agent is designed for use as a secondary sealant in dual-sealed insulating glass units. Dow Corning has the only approved silicone sealants that can be used as a secondary edge seal in multiple pane insulating glass units with Southwall Heat Mirror S series commercial construction product. Curing to form a durable, long-lasting and flexible silicone seal that is chemically stable, 982FS creates a weather-tight bond and offers excellent unprimed adhesion to glass. The silicone insulating glass sealant“s unique weatherability enables it to retain design properties even after years of exposure, ultimately enhancing commercial buildings“ durability levels and structural capabilities. Southwall Technologies and Dow Corning will showcase this solution at Greenbuild 2010 in Chicago, US, 17-19 November.

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