The newest evolution of RealView® 1.9 lightweight from SCHOTT, called RealView® 1.9 lightweight ultra, will be unveiled at SPIE AR | VR | MR 2022.
The new generation wafers feature a 1.9 refractive index (RI) while shaving off 50 percent of waveguide weight. Previously, SCHOTT RealView® 1.9 lightweight had already reduced the weight of wafers by 20 percent due to its low material density when it launched in September 2021.
Now with RealView® ultra, the glass lovers at SCHOTT have improved the wafer’s flatness by up to 60 percent, which enables AR device makers to remove another 30 percent from the scale for a total weight reduction of 15 grams per device.
This represents a major step towards the targeted 70 gram overall device weight and demonstrates SCHOTT’s continued commitment to the growing AR industry.
