Saflex, a business unit of Solutia Inc., has launched a new encapsulant designed, the company says, specifically to improve solar panel throughput and processing costs for solar module manufacturers u…
Saflex, a business unit of Solutia Inc., has launched a new encapsulant designed, the company says, specifically to improve solar panel throughput and processing costs for solar module manufacturers using the vacuum encapsulation process. Saflex PG41, is a new thin gauge encapsulant using embossing technology and is the latest addition to Saflex fast growing PV encapsulant portfolio. Embossing is a mechanical technology that creates “micro channels“ on the surface of the encapsulant, which provide a quick and efficient manner to remove air during the vacuum encapsulation process. “It follows the same logic as having treads on a tire,” comments Christopher Reed, business director for Saflex Photovoltaics. “By embossing the surface, we“re providing a means to speed up the vacuum encapsulation process which then increases throughput and ultimately lowers processing costs.” Saflex was a pioneer in embossing technology during the 1990“s, when it was used to improve the vacuum lamination process for manufacturers of automotive windscreens. “Our company has been innovating products for decades for use in automotive and architectural applications. We“re now bringing this scale and expertise to the photovoltaic market; embossed technology is yet another example of what can bring to module manufacturers,” continues Reed. Embossing also pulls more air out of the module and therefore improves yields by reducing visual defects caused by air bubbles trapped in the encapsulant. This is especially important for aesthetic applications, such as Building Integrated Photovoltaics (BIPV), where optical quality and appearance is fundamental.