Corning Incorporated and the Soitec Group announced at the end of July 2009 that they have signed an agreement to work together on the development of high-performance silicon-on-glass (SiOG) substrate…
Corning Incorporated and the Soitec Group announced at the end of July 2009 that they have signed an agreement to work together on the development of high-performance silicon-on-glass (SiOG) substrates used in the flat panel mobile display market. The work of the two companies will focus on top-performance backplane substrate technology for organic light-emitting diode (OLED) mobile displays. This co-development work will address the key challenges to broad commercialization of the high-quality, cost-effective displays promised by mobile OLED technology, including backplane electron mobility and uniformity, and lower total system cost. Outstanding electrical backplane performance should, as a result, enable display manufacturers to achieve simplified processing and complex circuit integration. We are pleased to be working with Soitec, a leader in silicon-on-insulator (SOI) and silicon film transfer technology for the semiconductor industry, said Dr. Mark A. Newhouse, senior vice president and director, New Business Development, Corning Incorporated. This co-development work should lead to faster delivery of our SiOG substrates, which can enable the development of high-quality, cost-effective OLED displays, he added. This cooperative effort between Corning and Soitec is a natural extension of both companies“ core competencies. Together we hope to create low-cost, high-performance substrates for the mobile flat panel market, said Andr-Jacques Auberton-Herv, president, the Soitec Group. In addition to the focus on mobile display substrates, the co-development work can explore alternative applications for engineered substrates using glass and semiconductor thin films, which could significantly enlarge our portfolio of applications.